Overview
In the PCBA welding process, reflow temperature fluctuations directly affect signal transmission performance.
The digital system can monitor the furnace temperature in real time and automatically associate the product barcode to ensure that the process data of each PCB is traceable.
Challenges and Solutions
Challenge 1
Customer audits require a large amount of process data, which is time-consuming to organize manually.
Solution 1
The PIS system automatically generates data dashboards to centrally display production information.
Challenge 2
It is difficult to ensure process consistency during multi-line production.
Solution 2
The SPC function compares the oven temperature data of each line in real time and automatically optimizes the parameters.
Challenge 3
Solder paste addition depends on manual work, which may cause omission or over-addition.
Solution 3
Automatic solder paste adding device controls the quantity to reduce waste.
Value and Results
YiYTxin: Centralized management of process data improves customer audit efficiency.
JiuZDzi: Reduce batch defects through real-time monitoring and reduce annual rework costs.
DaF: Automatic solder paste adding device saves labor and reduces solder paste waste.
Customer application scenarios
The PIS system is installed on the HELLER/JT reflow furnace and connected to the MES system.
For example, YiYT Xin displays the reflow temperature data in real time through a large screen, and the workshop and office area are monitored synchronously to respond to abnormalities quickly.

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