Real-time monitoring

Wave Soldering Profile Intelligent System
WAPS

Intelligent digital control solution for wave soldering equipment. The system monitors key parameters such as solder wave temperature, chain speed, motor speed, oxygen content, etc. in real time. Combined with visual data management, it ensures that the furnace temperature curve and soldering time of each PCB can be traced, helping enterprises improve welding quality and production efficiency.

  • Product Value

  • Core functions

  • Applicable scenarios

  • Product parameters

  • Related materials

  • Recommended products

Product Value

Quality control

Real-time monitoring of the oven temperature curve and tinning time of each PCB
Ensure soldering consistency and reduce defective rate

Risk Warning

Automatically alarm abnormal parameters to prevent production accidents and reduce downtime losses

Data traceability

Supports code scanning traceability and report generation to meet the requirements of quality management systems (such as SPC MES)

Efficient upgrade

No need to modify equipment, quickly deploy digital management and control capabilities, adapt to Industry 4.0

Core functions

WAPS波峰焊炉温曲线智能监控系统2.png

Visualized wave soldering management continuously monitor the temperature curve and soldering time of each PCB

The industry's first to achieve dual temperature collection of tin furnace + tin wave temperature: tin cylinder temperature monitoring
Deploy a high-temperature resistant and rugged thermocouple and tin wave main and secondary wave surface temperature monitoring (VCAM's first)

Wave soldering turbulent flow motor speed monitoring (first introduced by VCAM)

Height detection of double solder wave

Support segmented chain speed monitoring: supports up to 4 segmented chain speed monitoring

Optional: infrared detection of product surface temperature when it leaves the board

Applicable scenarios

Real-time monitoring of production lines: dynamic monitoring of wave soldering furnace temperature, chain speed, vibration and other parameters

Quality analysis: automatically generate quality trend reports through CPK and SPC

Remote management: remotely view and control the production line, adapt to multi-factory collaboration

Process optimization: Adjust temperature zone settings based on historical data to improve welding yield

Product parameters

Accuracy 0.5℃
Resolution 0.1℃
Internal temperature resistance of the instrument 0 -75℃
Instrument sampling frequency 0.5S
Instrument operating temperature 15℃-80℃
Temperature data range 0-450℃
Communication mode between PC and controller TCP/IP
Thermocouple Type K type (custom length)
Number of channels Supports up to 38 temperature points access
Size 150mm*190mm*50mm(L*W*H)
Power Requirements 24V DC@ 500mA
Soldering pot thermocouple K type (customizable, temperature resistant 450℃)
Soldering wave thermocouple K type (customizable, temperature resistant 450℃)
Soldering wave motor speed 士1%
Sensor accuracy 士1%
Oxygen Analyzer Data Terminal 0-10VDC
Input interface support 0-10VDC
Chain speed sensor Accuracy: ±1%, resolution: 0.1cm, working range 20-70℃

Related materials

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WAPS wave soldering temperature real-time monitoring system

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"2024 Reflow Oven Market Research and Oven Temperature Monitoring Series White Paper"

VCAM combines the industry's practical testing experience and the challenges and problems faced by more than 200 companies in the reflow soldering process, as well as their expectations and suggestions for solutions, and has launched the "2024 Reflow Oven Market Research and Oven Temperature Monitoring Series White Paper" in order to achieve technological innovation and improvement.

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