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Product Value
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Core functions
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Applicable scenarios
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Product parameters
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Related materials
Product Value
Cost savings
No need to change solder paste packaging, reducing material waste and procurement costs
Improve efficiency
Remote monitoring - One person multiple machines mode Reduce labor costs Improve production efficiency
Stable quality
Real-time monitoring of temperature and humidity, precise quantitative addition of solder paste, and guaranteed printing quality
Intelligent management
Automatically calculate the number of times the stencil and squeegee are used to optimize production planning
Core functions

Automatic quantitative addition: servo motor accurately adds solder paste
Remote monitoring: remote control, real-time monitoring of temperature and humidity
Data storage and tracking: record usage and optimize maintenance
Permission settings: multi-user management to ensure security
Mobile addition: adapt to different production lines
Smart reminder: abnormal temperature and humidity reminder



Applicable scenarios
Automatic addition and management of solder paste in electronic manufacturing production lines
High-precision electronic component assembly and soldering field
Large-scale PCB manufacturing and mass production
Product parameters
Model | ID900 |
Size | 182(w)×101(D)×232(H)mm |
Tin feeding accuracy | ±0.5g |
The compatible capacity of the solder paste | 500g, Customizable 250g |
Tin output control amount | 5-99g |
Tin addition setting range | 5-30g |
Tin addition method | Fixed position addition, X direction movement addition |
Suitable for printing press | Various domestic and imported solder paste printing machines |
Warning method | Buzzer and tri color light |
Power supply | AC100-260V 50-60HZ |
Weight | 4.3kg |
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