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Video Introduction
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Product Value
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Core functions
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Applicable scenarios
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Product parameters
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Related materials
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FAQ
Video Introduction
PIS24-365
Product Value
Millisecond-level intelligent control, zero process deviation
Achieve full-process traceability and accurately locate quality issues and anomalies.
Core functions

Multi-source data fusion: 40-channel temperature curve (±0.5℃ accuracy) + vacuum pressure (0-100kPa range) synchronous acquisition
Multi-physics simulation: 3D thermal field dynamic simulation and vibration frequency domain spectrum overlay analysis
Intelligent compliance engine: CPK/PWI/Six Sigma multi-dimensional process capability matrix automatic evaluation
Extended architecture: optional track chain speed/gas flow/motor speed monitoring module





Applicable scenarios
Real-time production monitoring: 24/7 monitoring of core parameters such as oven temperature/vacuum degree/chain speed to ensure stable operation of soldering process
Equipment debugging and verification: When a new machine model is introduced or the process is changed, the optimal temperature curve and equipment parameter combination can be quickly established
Rapid defect tracing: Accurately locate the correlation between quality problems such as false solder joints/cold solder joints and furnace temperature fluctuations and abnormal oxygen content
Quality compliance audit: Automatically generate electronic process reports with timestamps to meet certification traceability requirements such as IATF16949
Product parameters
Accuracy | +0.5℃ |
Resolution | 0.1℃ |
Temperature measurement points | 20-38 |
Maximum number of channels supported | 40 |
Chain speed measurement accuracy | ±1% |
Temperature measurement range | 0-750℃ |
Temperature measurement resolution | 0.1℃ |
Communication | Ethernet |
Power Requirements | 24V 1.5A |
Barcode scanner access | Support 2 RS232 port input |
Device weight | 1.5KG |
Device size | L150*W190*H50 mm |
Compatibility | Compatible with most brands of profiler |
Related materials

PIS real-time temperature monitoring intelligent system
FAQ
Which is better for cleaning: dry ice or plasma?
Dry ice cleaning is mainly a physical method to clean stubborn stains, burrs, rosin, furnace surfaces, etc.
Plasma is mainly a chemical method, and physics plays an auxiliary role, activating the surface of the object, increasing the surface energy, and enhancing the surface adhesion.

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